QuantaFab Technologies
QuantaFab Technologies
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    • Lithography
    • Deposition
    • Etching
    • Thermal Processing
    • Packaging
    • Characterization
    • Metrology
  • Partners
    • Birck Nanotech Center
    • Elevate Ventures
  • Device types
  • More
    • Home
    • Services
      • Lithography
      • Deposition
      • Etching
      • Thermal Processing
      • Packaging
      • Characterization
      • Metrology
    • Partners
      • Birck Nanotech Center
      • Elevate Ventures
    • Device types
Get a Free Quote
  • Home
  • Services
    • Lithography
    • Deposition
    • Etching
    • Thermal Processing
    • Packaging
    • Characterization
    • Metrology
  • Partners
    • Birck Nanotech Center
    • Elevate Ventures
  • Device types
Get a Free Quote

Thermal Processing

 QuantaFab offers a full suite of thermal processing capabilities, including oxidation, LPCVD, annealing, and gas-phase doping, supporting both batch wafer processing and rapid, single-wafer thermal treatment. 

Horizontal tube furnaces

Specialty gas-phase processes

Horizontal tube furnaces

 A bank of Expertech horizontal quartz-tube furnaces supporting batch processing of multiple wafers across a wide range of configurations: wet and dry oxidation, LPCVD silicon nitride, LPCVD low-temperature oxide (LTO), LPCVD polysilicon/amorphous silicon, LPCVD TEOS, gate oxidation, general oxidation, and general and high-temperature annealing. 

Rapid thermal annealing

Specialty gas-phase processes

Horizontal tube furnaces

 Jipelec rapid thermal annealer (RTA) for fast, single-wafer thermal treatment with tight thermal budgets, alongside a Blue M furnace for traditional annealing processes. 

Specialty gas-phase processes

Specialty gas-phase processes

Specialty gas-phase processes

 Dedicated H2S CVD furnace, and nitric oxide annealing for specialized surface and interface treatment. 

Available furnace processes

RCA clean oxidation

Gate oxidation

General oxidation (wet & dry)

LPCVD silicon nitride

LPCVD low-temperature oxide (LTO)

LPCVD polysilicon / amorphous silicon

LPCVD TEOS

General anneal

Typical applications

Gate oxide and dielectric formation

Dopant activation and drive-in

Contact and interface annealing

Stress relief and crystal quality improvement

Passivation and surface treatment

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