Wire bonding
Flip-chip bonding
Flip-chip bonding
- Multiple thermosonic and ball/wedge wire bonding systems available: JFP WB-100, SB6e, Westbond 7400A, and Westbond 7476E. Suited for die-to-package and die-to-substrate interconnects across a wide range of pad sizes and pitches.
Flip-chip bonding
Flip-chip bonding
Flip-chip bonding
Finetech Fineplacer Lambda 2 flip-chip bonder for precision die placement and bonding, enabling compact, high-density interconnect schemes for advanced packaging and heterogeneous integration.
Dicing
Flip-chip bonding
Polishing
Accretech SS20, Disco DAD641, and Disco DAD-2H/6 dicing saws for precision wafer and substrate singulation. Capable of dicing silicon, III-V materials, glass, and other substrates into individual die for packaging or characterization.
Polishing
PCB prototyping
Polishing
ASAP-1 IPS Digital Sample Preparation System for precision substrate thinning and surface polishing, supporting wafer preparation, backside processing, and surface finish requirements prior to bonding or characterization.
PCB prototyping
PCB prototyping
PCB prototyping
LPKF PCB system — mill, plater, and press — for rapid, in-house printed circuit board prototyping. Ideal for integrating fabricated devices into test boards and system-level assemblies without outsourcing PCB turns.