QuantaFab Technologies
QuantaFab Technologies
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    • Lithography
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  • More
    • Home
    • Services
      • Lithography
      • Deposition
      • Etching
      • Thermal Processing
      • Packaging
      • Characterization
      • Metrology
    • Partners
      • Birck Nanotech Center
      • Elevate Ventures
    • Device types
Get a Free Quote
  • Home
  • Services
    • Lithography
    • Deposition
    • Etching
    • Thermal Processing
    • Packaging
    • Characterization
    • Metrology
  • Partners
    • Birck Nanotech Center
    • Elevate Ventures
  • Device types
Get a Free Quote

Characterization

 QuantaFab provides access to advanced material and device characterization tools spanning electron microscopy, optical spectroscopy, electrical and magnetic measurement, and surface analysis — from atomic-resolution structural imaging to millikelvin device testing. 

Advanced electron microscopy

Surface & structural analysis

Surface & structural analysis

 Themis Z double aberration-corrected S/TEM for atomic-resolution imaging and elemental mapping. Helios G4 UX DualBeam SEM/FIB for cross-sectioning, slice-and-view, and TEM sample preparation. Full tomography and 3D reconstruction available. 

Surface & structural analysis

Surface & structural analysis

Surface & structural analysis

 Panalytical MRD X'Pert Pro high-resolution XRD for crystal structure and strain. Kratos Axis Ultra DLD XPS for surface chemical composition. Omicron surface analysis cluster with XPS, LEED, UHV STM/AFM, HREELS, and integrated UHV synthesis and deposition for full in-situ characterization without air exposure. 

Electrical & magnetic characterization

Electrical & magnetic characterization

Electrical & magnetic characterization

 Eight probe stations from DC to 40 GHz, 4.5 K to 900 °C, and up to 2.5 T — including cryogenic (LakeShore CRX-4K, CRX-VF), high-temperature (MicroXact CPS-50-HT), and semi-automatic 8" wafer-scale (FormFactor PAV200) configurations. Keysight B1500A and Keithley 4200A for I-V and C-V. High-current curve tracer (2 kV / 100 A). Vector netwo

 Eight probe stations from DC to 40 GHz, 4.5 K to 900 °C, and up to 2.5 T — including cryogenic (LakeShore CRX-4K, CRX-VF), high-temperature (MicroXact CPS-50-HT), and semi-automatic 8" wafer-scale (FormFactor PAV200) configurations. Keysight B1500A and Keithley 4200A for I-V and C-V. High-current curve tracer (2 kV / 100 A). Vector network analyzer (10 MHz–44 GHz). Oxford Triton dilution refrigerator (10 mK, 12 T). Quantum Design DynaCool PPMS (1.8–400 K, 9 T) with VSM and broadband FMR. Quantum Design MPMS-3 SQUID magnetometer (1.8–1000 K, ±7 T, <10⁻⁸ emu sensitivity). 

Optical spectroscopy

Electrical & magnetic characterization

Electrical & magnetic characterization

 Spectroscopic ellipsometry (J.A. Woollam RC2, V-VASE, M-2000, and IR-VASE; 200–3000 nm and IR range) for refractive index, permittivity, and composition. Raman imaging microscopy (Thermo Scientific DXR3xi, 455/532 nm). PerkinElmer Lambda 950 UV-VIS-NIR spectrophotometer (190–3000 nm) with integrating sphere. Neaspec IR-Neascope for near-

 Spectroscopic ellipsometry (J.A. Woollam RC2, V-VASE, M-2000, and IR-VASE; 200–3000 nm and IR range) for refractive index, permittivity, and composition. Raman imaging microscopy (Thermo Scientific DXR3xi, 455/532 nm). PerkinElmer Lambda 950 UV-VIS-NIR spectrophotometer (190–3000 nm) with integrating sphere. Neaspec IR-Neascope for near-field optical imaging (TERS, NSOM, TEPL) and NanoFTIR ultrafast pump-probe. Polytec laser Doppler vibrometer. Microsanj NT220 thermoreflectance imaging. Thin-film stress measurement and Kruss DSA25 drop shape analyzer. 

What we measure

Crystal structure, strain, and orientation (XRD)

Surface chemical composition and bonding (XPS)

Refractive index, permittivity, and film composition (ellipsometry)

Raman and near-field optical spectra

I-V, C-V, and RF/microwave device performance (DC to 67 GHz)

Magnetic hysteresis, FMR, and SQUID magnetometry

Atomic-resolution structure and elemental mapping (S/TEM, EDS)

Low-temperature and cryogenic transport (down to 10 mK)

Thermal conductivity, Seebeck coefficient, and thermoelectric ZT

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