Physical vapor deposition (PVD)
CHA and Lesker e-beam evaporators, including flexible-substrate, contact-metal, and glancing-angle (GLAD) configurations, plus AJA e-beam evaporation/sputtering and magnetic and dielectric sputtering systems. Suited for metal contacts, interconnects, and reflective or magnetic films.
Chemical vapor deposition (CVD & PECVD)
Plasma-Therm Apex SLR HDPCVD, Axic PECVD, Carbon Nanotube PECVD, EasyTube 3000, Epigress, SCS Parylene CVD, and tube-furnace processes for nitride, LTO, polysilicon, and TEOS films. Strong step coverage for insulating layers and structural films on patterned topography.
Atomic layer deposition (ALD)
Veeco Fiji G3, Cambridge Nanotech Fiji, ASM F120, and Arradiance GEMStar ALD systems (including glovebox-integrated configurations) for self-limiting, angstrom-level film growth. Ultra-conformal coatings for high-aspect-ratio and nanoscale structures, ideal for gate dielectrics and barrier layers.
Epitaxy & specialty growth
GaN molecular beam epitaxy (MBE) and pulsed laser deposition (PLD) for compound semiconductor and complex oxide thin films requiring precise crystalline control.
Electrodeposition
IKO Jr electroplater and Princeton Applied electrodeposition systems for metal plating, including applications in MEMS, packaging, and interconnect fabrication.