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Etching
Wet
Wet etching is a simple, inexpensice, high-throughput method for selectively removing materials like Si, metals, and oxides using chemicals such as KOH, TMAH, HF, or BOE.
Dry
The cleanroom offers diverse etching tools: RIE and ICP RIE systems (March Jupiter II, Panasonic E620, Plasma-Therm Apex SLR) handle Si, oxides, nitrides, III-Vs, metals, and polymers with gases like O₂, Ar, SF₆, CHF₃, CF₄, and Cl₂. The Xactix E1 XeF₂ enables vapor-phase etching of Si, Mo, Ge, SiGe, and W for high-selectivity, non-contact processing.