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Etching Services at QuantaFab Technologies
Wet
Wet etching is a simple, inexpensive, high-throughput method for selectively removing materials like Si, metals, and oxides using chemicals such as KOH, TMAH, HF, or BOE. While wet etching is effective, it is also important to consider dry etching techniques and the various etching tools available for different applications.
Dry
The cleanroom offers a variety of etching tools for both dry etching and wet etching processes. The RIE and ICP RIE systems (March Jupiter II, Panasonic E620, Plasma-Therm Apex SLR) are capable of handling materials such as Si, oxides, nitrides, III-Vs, metals, and polymers using gases like O₂, Ar, SF₆, CHF₃, CF₄, and Cl₂. Additionally, the Xactix E1 XeF₂ facilitates vapor-phase etching, providing high-selectivity, non-contact processing for Si, Mo, Ge, SiGe, and W.